Direct metallization methods for micro-electronics and advanced manufacturing

Micropatterning of conductive traces on non-conductive surfaces such as glass, silicon and flexible plastic substrates enables a multitude of novel micro-electronics applications. New additive techniques are constantly proposed such as 3D printing, metal plating of modified surfaces. This talk will cover newly created manufacturing processes for the metallization of non-conductive surfaces such as silicon, glass, PDMS and thermoplastic polyurethanes. Direct metallization of modified photoresists and surface modification by ion exchange and subsequent plating will be discussed during the seminar. These proposed metallization methods are alternatives to conventional vacuum technology and may open new opportunities in micro-electronics manufacturing.